Electroless plating of Ni-W-P alloys on silicon from aqueous solutions
Abstract
Electroless deposition of Ni-W-P films on silicon has been studied. The effect of the solution composition and operating parameters on Ni-W-P film deposition rate, microstructure and adhesion has been investigated and optimal conditions of alloy plating have been found. It has been shown that Ni-W-P films on thin Ni-P layers inhibits copper diffusion into silicon.
About the Authors
L. I. Stepanova
Research Institute for Physical Chrmical Problems of the Belarusian State University
Belarus
Belarus
V. G. Sokolov
Research Institute for Physical Chrmical Problems of the Belarusian State University
Belarus
Belarus
K. V. Skrotskaya
Research Institute for Physical Chrmical Problems of the Belarusian State University
Belarus
Belarus
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