Electrochemical deposition of Au-Sn alloy from ethylene glycol electrolytes

Abstract

Stable ethylene glycol and aqua-ethylene glycol electrolytes on the base of K[Au(CN)₂] and SnCl₄ for the electrochemical deposition of Au-Sn alloy with metals ratio and phase composition appropriated to the low-melt eutectic (Au - 70 at.%, Sn -30 at.%, Au₅Sn, AuSn) have been elaborated. The role of electrolytes components in the redox processes proceeding on the cathode and anode and their on the rate of deposition and Au : Sn ratio in the alloy have been developed. Composition and structure of Au-Sn alloy coatings have been investigated.